BGA Activated Rosin Solder Paste Tin Cream

التصنيف:

الوصف

  • MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
  • Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
  • High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.
  • Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
  • Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.

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